欣銓科技提供晶圓級晶粒尺寸封裝(Wafer Level Chip Scale Packaging)後段製程服務。包含晶片研磨/晶背貼膠/晶背打印/雷射預切/晶粒切割/自動光學檢視/並將IC直接用機台放置於Carrier tape中。
| Main Process Equipment | |||||
| No | Stage | Key Process Name | Brand | Model | |
| 1 |
TAPE |
BG Tape lamination (8" / 12") |
Nitto | DR3000III | |
| Lintec | RAD-3520 | ||||
| 2 |
BGD |
Wafer Backgrind (8" / 12") |
Disco | DFG8560 | |
| Accretech | PG3000RM | ||||
| 3 |
De-TAPE |
BG Tape remove (8" / 12") |
Nitto | HR3000III | |
| Lintec | RAD-3010F/12 | ||||
| 4 | WLM | Wafer Laser mark | EO | CSM3000 | |
| 5 | MOUNT | Wafer Mount | Nitto | MA3000III | |
| 6 | LG | Laser Grooving | Disco | DFL 7161 | |
| 7 | DICING | Dicing Saw | Disco | DFD 6362 | |
| 8 | PSI (AOI) | Post Saw Inspection (Auto Optical Inspection) | Camtek | Condor 103 PD | |
| EAGLE Ti PLUS | |||||
| 9 | TnR | Die Sorter(Tape & Reel) | STI | Isort-Maxx | |
| Isort-Express | |||||
| 10 | IR_FVI | Die IR Inspection (Reel) | Daitron | WVIS-RRHIR-S200 | |
| 11 | TnR LA | Die Inspection (Reel) | Daitron | PRS2500 | |